micro laser line treatment and perforation

Monday, April 03, 2006

Micro laser perforation technology

Laser perforation in general, possible to perforate by pulsed or enlarged focused laser beams are holes sizes from 60-200 microns at density of holes of typically 10-30 holes per cm, holes sequences 100,000-400,000 holes per second at a maximal of 16 punctured laser rows cross web with traditional systems or machines.

Means in cigarette, tipping, plug wrap, filter, flexible packaging, packs, tear tape, plastic and
other material webs.

With porosity levels from 100-3,000 C. U., normally in web widths from 100-500 mm,
in particular cases up to 1,500mm, at web speeds of up to 600 m/min, depending on porosity and material consistency in relation to its ability to perforate.

IPM laser cluster material treatment and micro perforation technology

LPM-1 is patent granted by DE102004001327, operates with quadruple Co2 carbon or other laser beam inputs up to 4 Kilowatt to a high power twin vacuum level multiplexer to generate up to 200 individual laser output channels and perforation rows cross web, combines automatic positioned laser perforation heads, focus setting, web speeds up to 400 m/min, web widths up to 2,000mm, up to 2,500,000 holes per second, jumbo roll-by-roll production, optical inline permeability as perforation line position control, porosity feedback, hi-tech automation level and other features. Each laser micro perforation lines can achieve 100-1,000 C.U.

Industry fields

The conception of high power twin level laser beam multiplexer enables hundred options in other industry application fields as cutting, cut-off, welding, surface finishing, high-speed drilling, ablation, cleaning, micromachining, polishing, forming, melting, surface treatment, roughness improvement.

Each up to 200
single laser beams is coupled via flexible hollow fibers allows treatment processes or micro perforation heads easy to position in X across and in Y direction of running web or static placed sheet material. The automatic processes, equipments and devices open now outstanding possibilities in industry, metal, plastic, domestic, tobacco product, medical, hygienic, wall covering, security cards, bank notes or food application.

LPM-1 means cluster material treatment at wide web, large area, surface or whole material
treatment, high power dual rotation laser beam splitter, twin multiplexer level, Co2, YAG, EXCIMER, DIODE, SOLID STATE laser with multiple optical inputs, flexible hollow waveguide fibers, HCW, HWG up to 200 output channels.

Material treatment with robot handling for stainless steel, ceramic, aluminum,
wafer, glass, ceramic, brass, copper, wafer, silicon, plastic sheets, titanium, jewelry, silicon, solar, panel, photovoltaic, micromachining, slitting, rewinding, refining, hybrid laser cutting machines or stand along systems.

Anti piracy counterfeiting design and cluster system

As known offline laser perforation machines or processes generating strait holes lines in web direction of running cigarette tipping paper webs or other materials. Excluding spray laser designs which looks similar as random holes into certain zone areas as electrostatic perforation. The world wide new and patent pending DE102004012081 Micro-Laser-Line MLL-1 technology generates cluster pattern, micro holes, sinus, waves, zigzag, cryptograms, logos, holograms, brand names or other kind of perforation designs in web direction which can look like as a group of micro laser lines. Concerned tipping paper means non coaxial circumference at cigarette filters.

New beam divert moving, scanning, flipping
elements control each single laser perforation lines in cross material direction which are precise focused for micro holes in ranges from 50-120 microns. All to uses for laser sources and types as Co2, YAG, EXCIMER, UV, FIBER, SOLID STATE or DIODE.

Super high-speed Co2 laser beam control

Technological approached as ultra-high scan speeds up to 4,000 Hz or 240,000 rpm with commercial air-bearing motors. REAL galvanometer scanner alternatives, precise laser beam deflection up to 4 Kilowatt Co2 by high dynamic performances. From 8-15mm laser beam aperture diameter, advantage beam quality factor M2 less 0.9 for focus spots down to 60 micron.

Absolute diffraction limits, because small
focused spot sizes which are proportional inversely of laser beam input diameter. In other words, larger laser beam apertures will produce smaller focused spot sizes, as especially needed for micro cluster perforation, drilling and other micro machining applications.

Spin actuator with special optical coating,
optimized outer shape, very precise rotation balance by inner body laser ablation, hollow body with inner cavities by low mass material condition, excellent relation of stiffness-to-weight, high hardness, adapted total vibration free vacuum cylinder case. Asymmetrically rotary reflection cones from 40-80mm base diameter, average mirror surface roughness lower as 0.1 micron, form accuracy lower 0.01 micron, operation sequences are precise synchronize with material speed. Envelope curves of the selected perforation pattern are storage and calculated by PLC control before single holes and holes groups supervised during production processes.

Product processes and advantages

MLL-1 enable total different product indicators and milestones against other laser perforation or material treatment processes which allows significant product property, trademark indications, patent claims, unique company features in micro perforation of tipping, cigarette packaging or other paper or material.

E.g. wide range of laser perforation groups as common active ventilation zone to obtain several advances in air stream distributions into cigarette filter, perfect perforation line guiding around cigarette filters or other food, domestic, industry products to assure constant porosity results.

Several pattern or
wave line design for different brands, number of holes or pattern with 10-20 per cm length are constant, porosity range 100-1,000 C.U., holes sizes 60-120 micron, holes densities from 100,000-500,000 holes per second in total. From 1 up to 6 perforation pattern, lines, marks or scripts can combines a group, perforation hole, pattern quality or porosity remains in standard levels.

Other web material, substrate or
products are treatable in similar processes, existent laser perforation, treatment machines are able to modify with new optical, micro mechanical and control elements.

Low investment and finance budget of technical modifications because exchanges of certain components, complete devices are adaptable on
existent offline perforation machines or other laser treatment handling systems.

Capability to adapt beam
divert devices or units at online perforation system at cigarette making machines up 12,000cpm.

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Outstanding Micro Cluster Production Technologies

MLL-1 anti piracy micro laser treatment, line perforation real alternative for galvanometer or scanner, super-high speed rotate cone mirror up to 4,000 Hz or 240,000 rpm, cluster micro technology for holes pattern, perforation design, waves, zigzag or packages lines, cryptograms, company logos, holograms, anti piracy, counterfeiting, security paper, safety, bank note, metal sticker, printing, laminating, coating, fruit, food, bread, vegetable, agriculture covering, credit cards, transparent film, holographic paper, cigarette, tipping, filter, aluminum foil, shrinkable film, tear tape, cardboard, matrix code, identification, RFID, tag, marking, scribing, jewelry, automotive, pharmacy, golf, marina, tobacco, smoking, chemical, medical, product, electronics part, indicator, porosity contours or profile, embossing, bioengineering, membrane, filtration, focus, holographic, hinge-lid, pack. Patent pending DE102004012081.

LPM-1 micro laser cluster perforator, material treatment at wide web, large area, surface or entire material cluster treatment, cutting, welding, drilling, ablation, cleaning, melding, high power, ultra high speed rotate quad or twin laser beam splitter, twin level vacuum multiplexer, up to 4 Kilowatt laser input, flexible hollow fibers, HGW, HCW, up to 200 output channels, Co2. Material treatment and robotic handling for stainless steel, ceramic, aluminum, wafer, gold, glass, silver, brass, copper, wafer, silicon, titanium, silicon, solar, panel, photovoltaic, micromachining, slitting, rewinding, refining machines or stand along systems. Micro cluster perforation for all kind of paper or specific plastic web material. Patent granted DE102004001327.

Nano Micro perforation or other material surface treatment, electrostatic cluster perforation, micro perforator, for cigarette, tipping, filter, packaging, plug wrap, Kraft, cement, pet, powder, sack, bag, fine and other paper, silicon or other coating, certain plastic film, laminate, porosity from 80 up to 2,500 C.U., from 50 down to 4 Gurley, hole sizes from 50 nm up to 100 micron, hole densities from 80-260 h/cm2, zone widths from 2.0-6.0mm, up to 16,000,000 holes per Second, web speeds up to 600 m/min, web widths up to 2,000mm. Patent granted DE10328937.

Twin AC/AC, AC/DC frequency shift converter high power, high frequency, high voltage, ultra short mega peak current, electrostatic nano or micro cluster perforation, ignition, sparking, arc, cigarette, tipping, filter, fine, packaging, paper, plug-wrap, sack, bag, Kraft, food, plastic film, foil, textile, fabrics or other product, switching converter, compressor, emergency, train, ship or vessel power supply, generator, fuel cell, upward, downward, frequency shift switching unit, stabilizer, soft starter, vector, phase, inverter, servo system, motion, stepping, machine, asynchronous, standard, motor, torque, automation, remote, gas, slab, laser, diode, stack, fiber, fibre optics, beam, material, hybrid, plug-in, battery, renewable, energy, medical equipment, membrane, filtration, robotic, photovoltaic, industrial automation, drives, IGBT, MOSFET, FRETFET, HVFET, tube, rf, hv. Patent granted DE10328937.

Online OPSS-1 porosity vision scanning control system permeability cluster control for electro static or laser micro perforation machines, multiple color sensor head, spectral intensity, DSP, FPGA, CCD, line, precise, laser, position, material finger print detection, VIS wave length, opacity, defects, inspection, image control, scanner systems, process software, line, camera, vision control, filter, tipping, cigarette, book, packaging, magazine, bible, wall, Kraft, paper, coffee, tea, food, co-extrusion foil, film, agriculture, cement, domestic or other moving fabrics or web material. Patent pending DE10251610, China patent granted 200310104764.

In-suit dyne or surface tension control ODSTM-1 at fast moving substrate, plastic, film, foil, tear tape, laminate, co-extrusion, BOPP, LLDPE, LDPE, PE, PP, PVC, MOV, MOH, FEP, PET, OPP, PTFE, MPET, spectral, extinction, monolithic, sensor, analyzing, Subangstrom, roughness, measurement, wavelength, wobbling, stray, light, beaming, water drop, angle, inspection, corona, plasma jet, laser, IR, NIR, scanning, monolithic spectrometer, photonics, spectral, properties, reflectometer, scatterometry, ellipsometry, opto, acoustic, basic, weight, techniques, corona, flam, gas treatment. Previous patent application DE19543289.

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Patent references
http://www.wikipatents.com/gb/2149092.html
http://www.wikipatents.com/de/3332886.html
http://www.wikipatents.com/de/2918283.html
http://www.freepatentsonline.com/EP0460369.html
http://www.freepatentsonline.com/7224447.html
http://v3.espacenet.com/publicationDetails/biblio?CC=EP&NR=0460369&KC=&FT=E
https://www.patent-net.de/index.php?content=projekt&id=163
https://www.patent-net.de/index.php?content=projekt&id=213
https://www.patent-net.de/index.php?content=projekt&id=155
https://www.patent-net.de/index.php?content=projekt&id=156
https://www.patent-net.de/index.php?content=projekt&id=214
https://www.patent-net.de/index.php?content=projekt&id=157
https://www.patent-net.de/index.php?content=projekt&id=158
https://www.patent-net.de/index.php?content=projekt&id=287

Technology down loads
http://www.microperforation.com/mll-1-laser-perforation.html
http://www.microperforation.com/lpm-1.html
http://www.microperforation.com/opss-1-optical-online-porosity.html
http://www.microperforation.com/igbt-esp-unit.html
http://www.microperforation.com/ipm-spanish.html
http://www.microperforation.com/online-perforation-cigarette.html
http://www.microperforation.com.cn/ipm-technology.html
http://www.microperforation.com.cn/ipm-spanish.html
http://www.deguodaguan.com/ipm/Reports-china.html
http://www.deguodaguan.com/ipm/englishengineerreport.html
http://www.deguodaguan.com/ipm/optical-dyne-control.html

IPM - International Perforation Management
hi-tech engineering - Asia - Europe - Asean
Mr. Werner Grosse
Tel./fax : 0049-3212-5097465
http://www.microperforation.com
http://www.microperforation.com.cn
http://www.deguodaguan.com/ipm/

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